Company Profile

Sales Representatives

Contact Us

Custom Heat Sinks

Custom Extrusions & Machining

Engineering Support & Services

Extrusion Profiles

Board Level

Microprocessor & BGA

Fan Sinks

DC to DC Converter

TI DLP Device

Extruded High & Medium Power   

Bonded & Folded Fin

Heat Pipe Assemblies

Interface Materials,

Clips & PC Board Accessories

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Interface Materials, Clips

and PC Board Accessories

Services include material selection assistance, piece part die-cutting, and

pre-application of thermal interface materials to your heat sink.

Many standard sizes and configurations of thermal interface materials are available.

Standard and custom thermal interface pads available for purchase separately or as part of a heat sink assembly.

• Used to fill the small air voids between the device being cooled and the heat sink

• Acts as an attachment method

• Used to lower the interface resistance

• Electrically insulating

• Electrically conductive

• Pads:  Grafoil, Soft-Face, Hi-Flow, Thermflow, and others

  • Stamped into any shape or size

  • Alternative to using silicon grease, which is messy and hard to evenly apply in a manufacturing environment.

  • Helps to lower the interface resistance

  • Pre-applied by M&M Metals to help decrease customer cost

• Pads:  Sil-Pads, Gap-Fillers, and others

  • Provides electrical isolation

  • Can have adhesive on one, both, or no side

  • Pre-applied by M&M Metals

• Double Sided Tapes for Heat Sink attachment

  • Pre-applied by M&M Metals

• Grease or Thermally Conductive Adhesive for Heat Sink attachment

     Chomerics

(or other customer specified supplier)

MM5101

MM5102

MM5103

MM5105