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Engineering Support & Services
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Microprocessor & BGA Heat Sinks | |||
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Standard and custom heat sink solutions for today's microprocessor, BGA's, motherboard, and networking applications. Compatible thermal interface materials and attachment technologies also available.
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HEAT SINK PART NUMBER |
LENGTH (L) X WIDTH (W) |
HEIGHT (H) | ||
| 1.105 X 1.300 | 0.490 |
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| 1.235 X 2.015 | 0.335 |
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| 1.950 X 1.875 | 1.000 |
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| 1.110 X 1.200 | 0.650 |
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| MM5084 SERIES HEAT SINK | 1.100 X 1.100 | 0.195 |
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| MM5088B HEAT SINK | 1.010 X 1.010 | 0.355 |
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MM5091B HEAT SINK |
1.105 X 1.105 | 0.355 |
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MM5098B HEAT SINK |
1.235 X 1.300 | 0.490 |
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| MM5099 SERIES HEAT SINK | 1.105 X 1.105 | 0.250 |
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| MM5106B HEAT SINK | .992 X .992 | 0.490 |
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| 1.625 X 1.875 | 1.000 |
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| MM7103 SERIES HEAT SINK | 1.755 X 1.800 | 0.650 |
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